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Huawei's return to chip manufacturing highlights its ability to circumvent the U.S. restrictions imposed since 2019 by developing technologies that enhance chip performance and increasing reliance on domestic manufacturing. The company has managed, through strategies such as logic circuit stacking and 3D structural techniques, to surpass manufacturing technology constraints and move closer to achieving self-sufficiency in the semiconductor sector, after being heavily restricted. Currently, Huawei faces challenges related to high energy consumption and the pursuit of profitable production, as it seeks to compensate for performance shortcomings by connecting a large number of chips in powerful computing systems, potentially competing with products from global companies like Nvidia.
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