اقتصاد سكاي نيوز عربية
اقتصاد سكاي نيوز عربية
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Samsung Electronics announced the signing of a memorandum of understanding with the American company Broadcom to strengthen cooperation in the semiconductor and artificial intelligence industries, with an expected partnership value exceeding $200 billion by 2030. The collaboration will focus on developing high-performance memory chips and 2-nanometer semiconductor manufacturing technologies, including advanced wireless connectivity solutions, aimed at supporting the next generation of AI and improving energy efficiency in tech products. This alliance highlights a significant strategic importance in enhancing both companies' positions in the global semiconductor market.
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