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Chinese company Xiaomi has launched the new generation of its smartphone processor, the Xring O3, manufactured with 3-nanometer technology. It features 10 high-performance cores, along with notable improvements in performance and smart technologies. The processor's multi-core performance exceeded 15,000 points in the AnTuTu benchmark, with an 85% increase in graphics processing unit (GPU) performance while reducing power consumption by 64%. The processor also supports LPDDR6 memory speeds of up to 113.8 GB/s, surpassing the previous Xring O1 generation by 48%. It boasts high capabilities in artificial intelligence tasks, reaching 200 trillion operations per second, along with improved image accuracy and reduced video noise. Additionally, it supports a new platform for running local AI models. Mass production of the processor is expected to begin in 2025 and will be used in Xiaomi's upcoming foldable phone, expected to be launched in September, with a shipping target of between 200,000 and 300,000 units.
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