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Chinese company Huawei has announced the development of a new pathway in chip manufacturing aimed at narrowing the gap with TSMC, without relying on the latest manufacturing equipment due to American restrictions. The new techniques focus on reducing signal latency within the chip rather than shrinking transistor sizes, with their application extending to over 381 chips over six years, some of which are entering mass commercial production. This development reflects Huawei's efforts to restore its position in the chip market following US-imposed restrictions since 2019.
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