Samsung-Broadcom deal valued at $200B
Samsung Electronics announced the signing of a memorandum of understanding with American company Broadcom to enhance collaboration in the fields of semiconductors and memory chips, with the aim of supporting the new generation of AI infrastructure. The joint cooperation is expected to exceed $200 billion by 2030, including the development of ultra-high-performance chips and advanced packaging techniques at 2 nanometers and below, to boost AI technology production and reduce energy consumption. The two companies seek to expand their partnership to gain control of the AI chip market and achieve significant technological advancements in the semiconductor industry.
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