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Chinese company Huawei has unveiled a new high-performance chipset, the Kirin 9050 Pro, which utilizes logic folding technology and incorporates stacked logic units within the chip to reduce response times and enhance overall performance. This chip is introduced alongside the launch of the triple-folding Mate X2 phone, reflecting the company's ongoing commitment to innovation and technological advancement, especially after six years since the last Kirin processor release. In the first half of the year, Huawei achieved its highest research and development expenditure to date, totaling $17.9 billion. Its strategic focus on expanding in artificial intelligence, chip technology, and embedded systems has played a key role in boosting its market share to 22.6% in China, with a 19.4% increase in smartphone shipments compared to the previous year.
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