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Huawei has revealed its plan to develop AI chips through 2027, aiming to create massive computing systems by linking large numbers of chips instead of relying on a single ultra-powerful chip. The company will launch two new chips: /960DT/ and /Ascend 960PR/. The first is expected to be released in the first quarter of 2027, and the second in the third quarter of the same year. Huawei is also working on developing components based on /UnifiedBus/ technology, which can manage large interconnected systems capable of handling up to one million AI processors, thereby enhancing its ability to run complex AI applications that require immense computing power.
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