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وكالة الأنباء القطرية
Huawei plans AI chip development by 2027
Huawei has announced its plan to develop AI chips by 2027, focusing on connecting a large number of chips to form massive computing systems instead of relying on a single powerful chip. The company will launch two new chips, "960DT" and "Ascend 960PR," during 2027, with the former scheduled for release in the first quarter and the latter in the third quarter. The company's interconnected systems, known as "Superclusters," can handle up to one million AI processors simultaneously. Currently, they include 5,270 active developers monthly, reflecting Huawei's ambition to meet the demands of complex AI applications that require enormous computational power.
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